Siconnex batch sprays allow for chemical treatment of semiconductor substrates. It is possible to process entire lots with high repeatability and speed.

Technical Specifications

• Processes performed in batch mode (25 plates) in the dry-in / dry-out system
• Processes are carried out on substrates with diameter size of 100 mm, 125mm, 150 mm and 200 mm
• The purity of the substrates after the process is less then 50 particles with a maximum diameter of 0.2μm

Application

• Etching of thin layers of silicon dioxide, polycrystalline and monocrystalline silicon, silicon nitride, thin metallic layers – aluminum, titanium and others
• Cleaning of chemical substrates in SC1 (NH4OH, O3), SC2 (HCl, O3), Piranha (H2SO4 and O3) and in diluted HF solution