High Temperature Horizontal Furnaces and LPCVD

Two stacks of horizontal furnaces by Termco System enables repeatable high-temperature processes for micro- nano- electronics, photonics and photovoltaics applications.

Technical Specifications

  • Two furnaces has 3 independent tubes for high temperature processes
  • The processes chamber allows loading up to 50 silicon wafers in diameter of 100mm and 150mm, and up to 25 silicon wafers in diameter of 200mm


  • High temperature annealing up to 1200°C
  • Wet and Dry oxidation
  • Ultra-Thin silicon oxidation
  • Boron diffusion
  • Low-pressure chemical vapor deposition ramped Poly Si (a-Si) and silicon nitride (Si3N4)

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