Magnetron sputtering

PlasmaPro 400 magnetron sputtering tool is an efficient and versatile system that can be used in many fields: semiconductor electronics, photonics, photovoltaics.

Technical specification

  • Vacuum loadlock for high throughput
  • Compatible with all wafer sizes up to 200 mm
  • Loading capacity of 4 wafers
  • DC magnetron sputtering for metals, pulsed DC for high rate, rf magnetron for dielectrics
  • Reactive sputtering adding O2, N2, H2


  • Deposition of metals (Al, Ti) and dielectrics (AlN, TiO2, Al2O3, TiN)
  • Deposition of oxy-nitrides (TiOxNy)

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