PlasmaPro 400 magnetron sputtering tool is an efficient and versatile system that can be used in many fields: semiconductor electronics, photonics, photovoltaics.

Technical specification

• Vacuum loadlock for high throughput
• Compatible with all wafer sizes up to 200 mm
• Loading capacity of 4 wafers
• DC magnetron sputtering for metals, pulsed DC for high rate, rf magnetron for dielectrics
• Reactive sputtering adding O2, N2, H2

Application

• Deposition of metals (Al, Ti) and dielectrics (AlN, TiO2, Al2O3, TiN)
• Deposition of oxy-nitrides (TiOxNy)