Resist processing (bake)

Sawatec hotplates for thermal treatment of wafers/resists.

Technical specification

  • Bake in HMDS vapor for adhesion improvement
  • Hotplate based Soft-Bake and Hard-Bake
  • Temperature stability up to 250°C
  • Optional purge with nitrogen
  • Substrate size from pieces, up to 200mm (round) and 150x150mm (square)


  • Initial conditioning and dehydration of substrate
  • Hardening of resists before exposure and other processes (e.g. etching).

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