Sawatec hotplates for thermal treatment of wafers/resists.

Technical specification

• Bake in HMDS vapor for adhesion improvement
• Hotplate based Soft-Bake and Hard-Bake
• Temperature stability up to 250°C
• Optional purge with nitrogen
• Substrate size from pieces, up to 200mm (round) and 150x150mm (square)

Application

• Initial conditioning and dehydration of substrate
• Hardening of resists before exposure and other processes (e.g. etching).