Semi-automated resist processing system by EVGroup (EVG) allowing complete chemical treatment of wafer substrate using photo and electro-beam lithography resists.
Technical specification
- Substrate size from pieces, up to 200mm (round) and 150x150mm (square)
- Drive unit speed up to 10 000rpm with ramp up to 1000rpm/s
- Dispense pumps for spin coating of resist of viscosities up to 400cps (line system)/20 000cps (syringe system)
- Programmable recipes
- “Suckback”, “Back Side Rinse” and “Edge Bead Removal” function
- Puddle and spray development
Application
- Coating and development of resist for photolithography and electron-beam lithography processes
