Resist processing (coating and development)

Semi-automated resist processing system by EVGroup (EVG) allowing complete chemical treatment of wafer substrate using photo and electro-beam lithography resists.

Technical specification

  • Substrate size from pieces, up to 200mm (round) and 150x150mm (square)
  • Drive unit speed up to 10 000rpm with ramp up to 1000rpm/s
  • Dispense pumps for spin coating of resist of viscosities up to 400cps (line system)/20 000cps (syringe system)
  • Programmable recipes
  • “Suckback”, “Back Side Rinse” and “Edge Bead Removal” function
  • Puddle and spray development


  • Coating and development of resist for photolithography and electron-beam lithography processes

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