Wafer bonding system EVG510/200 by EVGroup (EVG).

Technical specification

• Processing of semiconductor (e.g. silicon) and dielectric (e.g. glass, ceramics) substrate
• Bonding of substrates sizes from 50mm to 200mm
• Bonding techniques: adhesion, eutectic (thermocompression), anodic, glass frit, direct
• Temperature range from 50°C to 500°C, temperature control ±3°C
• Automatic substrate alignment on EVG6200NT

Application

• Wafer bonding for fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics