Wafer bonding system EVG510/200 by EVGroup (EVG).
- Processing of semiconductor (e.g. silicon) and dielectric (e.g. glass, ceramics) substrate
- Bonding of substrates sizes from 50mm to 200mm
- Bonding techniques: adhesion, eutectic (thermocompression), anodic, glass frit, direct
- Temperature range from 50°C to 500°C, temperature control ±3°C
- Automatic substrate alignment on EVG6200NT
- Wafer bonding for fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics