Wafer bonding

Wafer bonding system EVG510/200 by EVGroup (EVG).

Technical specification

  • Processing of semiconductor (e.g. silicon) and dielectric (e.g. glass, ceramics) substrate
  • Bonding of substrates sizes from 50mm to 200mm
  • Bonding techniques: adhesion, eutectic (thermocompression), anodic, glass frit, direct
  • Temperature range from 50°C to 500°C, temperature control ±3°C
  • Automatic substrate alignment on EVG6200NT


  • Wafer bonding for fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics

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